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Researchers & Faculty Japanese TOP page > Katsumi Miyama （Last updated : 2023-03-08 12:50:45） Katsumi Miyama Department / Course Hokkaido University of Science Faculty of Engineering Department of Mechanical Engineering Job Professor Achievement Academic background Present specialized field Book and thesis Academic conference presentation Academic background 2013/03Degree Acquisition   Present specialized field Others, Others Book and thesis Books Board design of device embedded substrate for miniaturization and high performance of electronic devices (Co-authored) 2021/12   Papers Development of the file performance tester based on the shaper Journal of the Japan Society for Abrasive Technology,pp.143-149 (Co-authored) 2023/03/01   Papers Circulation plating method for the piping manufactured by metal-powder bed fusion Chemical Industry,pp.95-103 (Co-authored) 2022/02   Papers Joining Interface of Plating and Solder Journal of The Surface Finishing Society of Japan,pp.530-536 (Co-authored) 2021/07   Papers Effects of External Bending Stress on Characteristic Change of Embedded Device Transactions of The Japan Institute of Electronics Packaging Vol.10 (No.1),pp.1-6 (Co-authored) 2017/12   Display All（12） Academic conference presentation 2019/11 Fabrication of Fine Pattern with Imprint Technique (ISMP-EMAP 2019)   2018/10 Effect of substrate construction on deformation and stress distribution of the device-embedded substrates (IMPACT 2018 Conference)   2018/07 The Sixth Japan-US NDT Symposium on Emerging NDE Capabilities for a Safer World (The 6th JAPAN-US NDT Symposium)   2017/04 Effects of External Bending Stress on Device-Embedded Substrate (2017 International Conference on Electronics Packaging)   2015/10 The application of thermographic measurement to defect detection beneath a nano-micro scale surface finishing film (JSNDI Fall Conference Intrenational Session)   Display All（14） Copyright © エデュース大学 --> COPYRIGHT (C) 北海道科学大学　ALL RIGHTS RESERVED. -->