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HOME Company COMPANY INFORMATION Company Information Message from the President Corporate Philosophy Company Profile Offices History Group Companies Products PRODUCTSTECHNOLOGY Products &＃038; Technology List of Products by Application Steel plate related Tinplate Tin Free Steel（Hi-Top） Laminated Steel Sheet（Hi-Pet） Electro-galvanized Steel Sheet（Silver Top） Nickel-plated Steel Sheet（Ni-Top） Cold Rolled Steel Sheet（TOP） Vinyl Chloride Resin Decorative Steel Sheet（VINYTOP） SF : Steel Foil Functional Materials Aluminum substrates for magnetic disks（MD） Functional film for optics（Fine Cast Film） Functional film for container（Fine Cast Film） New Materials DNA Chip Genetic Analysis System Research & Development List of products under development Sustainability SUSTAINABILITY Sustainability Society Procurement List of procured items The chemical substances (group) which Toyo Kohan regulates (The 8 edition) Inquiry --> HOME Company COMPANY INFORMATION Company Information Message from the President Corporate Philosophy Company Profile Offices History Group Companies Products PRODUCTSTECHNOLOGY Products &＃038; Technology List of Products by Application Steel plate related Tinplate Tin Free Steel（Hi-Top） Laminated Steel Sheet（Hi-Pet） Electro-galvanized Steel Sheet（Silver Top） Nickel-plated Steel Sheet（Ni-Top） Cold Rolled Steel Sheet（TOP） Vinyl Chloride Resin Decorative Steel Sheet（VINYTOP） SF : Steel Foil Functional Materials Aluminum substrates for magnetic disks（MD） Functional film for optics（Fine Cast Film） Functional film for container（Fine Cast Film） New Materials DNA Chip Genetic Analysis System Research & Development List of products under development Sustainability SUSTAINABILITY Sustainability Society Procurement List of procured items The chemical substances (group) which Toyo Kohan regulates (The 8 edition) Inquiry --> --> Products menu Products menu Steel plate related Tinplate Tin Free Steel（Hi-Top） Laminated Steel Sheet（Hi-Pet） Electro-galvanized Steel Sheet（Silver Top） Nickel-plated Steel Sheet（Ni-Top） Cold Rolled Steel Sheet（TOP） Vinyl Chloride Resin Decorative Steel Sheet（VINYTOP） SF : Steel Foil Functional Materials Aluminum substrates for magnetic disks（MD） Functional film for optics（Fine Cast Film） Functional film for container（Fine Cast Film） New Materials DNA Chip Genetic Analysis System Research & Development Research &＃038; Development Ultra-thin Steel Foil Electrolytic NiP Plating Pure Iron Foil Resin surface treatment for metal bonding Iron-based metallic foil for current collectors for all solid-state/advanced LIBs Silver Top for Composite Substrates with Excellent Resin Adhesion Flexible Copper-Clad Laminates (FCCL) Non-electrolytic plating resin film Clad Materials（FINE CLAD） HOMEProducts &＃038; TechnologyClad Materials（FINE CLAD） PRODUCTS Products & Technology／Research and Development Clad Materials（FINE CLAD） Toyo Kohan was the first in the world to develop and practically apply Fine Clad, a highly functional type of dissimilar metallic clad material, using our surface activation bonding process, a new room-temperature bonding technology under vacuum. Unlike conventional clad materials, Fine Clad is manufactured by pressure bonding at room temperature and under low pressure in a vacuum. This reduces the effects of heat and processing stress on the material, allowing for new applications that are difficult to achieve with conventional clad materials. Clad material coils(Copper/nickel, nickel/aluminum, aluminum/stainless steel clad) Features Materials can be bonded under low pressure (low load). No change in material properties (hardness, structure, etc.) after bonding. Excellent thickness precision. Bonding interface is flat. Foil lamination (from 10 µm) is possible. Thick materials that are difficult to coat with plating can be coated. Various material combinations are available. Ni/Al, Al/Al, Cu/Al, Al/SUS, etc. Bonding is performed under vacuum at room temperature. No alloy layer created at the bonding interface. Clad materials with good workability can be created. Soft materials with good workability can be clad in a way that maintains these properties. Toyo Kohan&＃8217;s Fine Clad materials are new composite materials (bimetals) that have never existed before. Comparison of Fine Clad and conventional clad materials ItemToyo KohanFine CladConventional clad materialsInterface flatness○△ or ×Interfacial alloy formationNoYesFoil bonding○×Thickness reduction rate0.1～5.0%30～70% May vary depending on combination of materials. Schematic diagram Manufacturing process A schematic diagram of manufacturing equipment is shown below. The overall setup is a vacuum chamber.All process of material → surface activation treatment → pressure welding → material rolling are performed under vacuum. Surface activation bonding method Manufacturing process Size Measurement pointsThickness(mm)MAX.width（mm）Material A0.015～0.2250Material B0.05～1.0250 Total0.06～1.0250 May vary depending on properties of materials. Cut sheet (100 x 130 mm) prototypes are also available for trial purposes. Material combinations (typical examples) Material AMaterial BAlNiAlAlNiCuAlSUSCuAl Please contact us to discuss any material combinations other than those listed above. Mechanical properties Change in mechanical properties after cladding MaterialThickness(mm)Hardness(Hv)Tensile strength(N/mm2)Before claddingSUS3040.201170703Al 1N990.0562459After claddingSUS3040.200173572 Strength as clad material As shown in the table above, there is no change in properties before and after cladding. Processing example Bending test cross-section 35μmCu／0.26mmSteel／35μmCu Example of clad material processing (front view)Al／mild steel　cladCu／SUS／Al　cladTi／Al／SUS　clad Example of stretch forming SUS/Al clad material (Top surface: SUS) Example applications In recent years, as mobile devices such as smartphones have better performance and faster communication speeds (5G), the issue of heat dissipation is becoming increasingly important. On the other hand, installation space available inside devices is limited, and materials that combine multiple functions are required to reduce the component count.To meet these needs, we have developed heat-dissipating reinforced clad materials (SUS/Cu and SUS/Al clad materials) with excellent heat dissipation and workability, as well as high strength. Features Excellent heat dissipation High strength Thin and lightweight Great workability Applications Chassis, center frame Shield case Display reinforcing panel Assessment of heat dissipation Heat-dissipating reinforcing clad materials show better heat dissipation than either stainless steel alone or stainless steel + graphite sheet. Graphite sheet can be eliminated, enabling a thinner profile. The above values were measured by Toyo Kohan, and are not guaranteed values. Example applications Recent years have seen multiple graphite sheets layered onto stainless steel to dissipate heat. In such cases, better heat dissipation can be achieved and the number of graphite sheet layers reduced by attaching a single graphite sheet to heat dissipation reinforced clad materials, instead of stainless steel. The above values were measured by Toyo Kohan, and are not guaranteed values. Mechanical properties CompositionClad materialSingle materialSUS／Cu（1：5）SUS／Cu（1：2）SUS／Al／SUS（1：4：1）SUS304A5052Tensile strength (MPa)3364083247132530.2% proof stress (MPa)209261201&＃8211;&＃8211;3-point bending strength (MPa)447506495519387Density (g/cm3)8.88.64.47.92.7 For a total thickness of 0.3 mm. The above values were measured by Toyo Kohan, and are not guaranteed values. Processing example SUS/Cu clad material SUS/Al/SUS clad material Award History Awards received for technology and R&D Year and month of awardDetailsOctober 2000Received the Technical Development Award from the Japan Institute of Metals and MaterialsJune 2001Received National Commendation for Invention (Keidanren Chairman’s Prize)April 2006Received Minister of Education, Culture, Sports, Science and Technology Award for Science and Technology (Development Category) Toyo Kohan Co., Ltd. Terms of Use Privacy Policy COOKIE Policy Site Map © Toyo Kohan Co., Ltd.